WSJ: Next iPhone to be thinner and lighter but more complicated to manufacture?

AppleThe Apple iPhone rumours continue to swirl. Citing “some suppliers of components to Apple,” The Wall Street Journal is reporting that the next iPhone will be thinner and lighter than the iPhone 4 and come with an 8MP camera. It will also use wireless baseband chips from Qualcomm rather than the Infineon chips found in the current iPhone 4. One thing not clear in the report is whether the new iPhone will feature a similar body to the current iPhone 4 or a completely redesigned one as other rumours have suggested.

According to a different source, Apple has also set itself the aggressive goal of selling 25 million new iPhones by the end of the year. The initial run will be for “a few million units.” Reaching that goal may be difficult as Foxconn (rather than Pegatron as another report suggested) is apparently finding the new device “complicated and difficult to assemble.

The report also sheds no light on whether the new iPhone will be known as the iPhone 4S or the iPhone 5.

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