Huawei surprised many at CES with its Ascend P1 S and P1 announcements. At 6.8 millimeters thick, the Ascend P1 S could well become the world’s thinnest smartphone when it launches (Q2 in North America). The company now appears to be preparing to impress further with another line of high-end smartphones.
Huawei device chairman Richard Yu told TWICE that the company “will take performance a step higher” with the upcoming Diamond series of smartphones. No details were given about this new line. Perhaps it will be one or more quad-core smartphones like upcoming devices from HTC, LG, and Samsung (and likely others).
Huawei will unveil the Diamond smartphone series at Mobile World Congress next month. It just so happens that Huawei has also planned a February 26th event (one day before MWC kicks off) where it promises to announce the “smartest, fastest and most high-performing smartphone yet.” All should be revealed in just over a month.